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ALTER EEE parts engineering and Product Assurance capabilities
EEE and Product Assurance scenario: The team of Senior EEE parts and PA engineers at ALTER will guide and help your team to understand the key drivers for the selection of the most suitable parts for your design, based on the deep knowledge of space market as well as the main standards used in Europe (ECSS-Q-ST-60s), US (NASA GSFC, DLA MIL-PRFs and QPL/QMLs) and commercial market (AEC-Q, …).
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ALTER EEE parts engineering and Product Assurance capabilities
EEE and Product Assurance scenario: The team of Senior EEE parts and PA engineers at ALTER will guide and help your team to understand the key drivers for the selection of the most suitable parts for your design, based on the deep knowledge of space market as well as the main standards used in Europe (ECSS-Q-ST-60s), US (NASA GSFC, DLA MIL-PRFs and QPL/QMLs) and commercial market (AEC-Q, …).
Advanced Materials for Space Radiation Shielding
Discover how the SRPROTEC project develops advanced composite materials to shield electronics from harmful space radiation
Physical Characterization of QFN Test Vehicles Manufactured with Radiation-Shielding Materials
Explore SRPROTEC project QFN test vehicles made with novel radiation-shielding composites for advanced electronic protection
Characterization of Novel Composite Materials with Radiation Shielding Properties for Electronic Encapsulation (SRPROTEC Project)
Discover SRPROTEC project innovations: novel composite materials with advanced radiation shielding for safe and reliable electronic encapsulation
Entangled photon sources for quantum communications
Entangled Photon Sources enable secure quantum communication through SPDC, ideal for high-loss space applications.
Electromagnetic Compatibility (EMC) fundamentals
Electromagnetic Compatibility (EMC) ensures devices operate reliably without causing or suffering electromagnetic interference.
Glassivation integrity in electronic components
Glassivation testing ensures the dielectric layer integrity in semiconductor devices to prevent issues like electromigration.
The use of optical transceiver technology within space vehicles
Optical transceiver technology enhances satellite communication with high-speed, low-power, and radiation-tolerant performance.
Meteosat MSG to MTG transition
Meteosat satellites provide continuous geostationary weather data for Europe and Africa via advanced imaging systems.
Life Test for reliability assurance
Life test assesses long-term device reliability by accelerating wear-out failures using voltage and temperature stress.
ALTER EEE parts engineering and Product Assurance capabilities
EEE and Product Assurance scenario: The team of Senior EEE parts and PA engineers at ALTER will guide and help your team to understand the key drivers for the selection of the most suitable parts for your design, based on the deep knowledge of space market as well as the main standards used in Europe (ECSS-Q-ST-60s), US (NASA GSFC, DLA MIL-PRFs and QPL/QMLs) and commercial market (AEC-Q, …).
Advanced Materials for Space Radiation Shielding
Discover how the SRPROTEC project develops advanced composite materials to shield electronics from harmful space radiation
Physical Characterization of QFN Test Vehicles Manufactured with Radiation-Shielding Materials
Explore SRPROTEC project QFN test vehicles made with novel radiation-shielding composites for advanced electronic protection
Characterization of Novel Composite Materials with Radiation Shielding Properties for Electronic Encapsulation (SRPROTEC Project)
Discover SRPROTEC project innovations: novel composite materials with advanced radiation shielding for safe and reliable electronic encapsulation
Entangled photon sources for quantum communications
Entangled Photon Sources enable secure quantum communication through SPDC, ideal for high-loss space applications.
Electromagnetic Compatibility (EMC) fundamentals
Electromagnetic Compatibility (EMC) ensures devices operate reliably without causing or suffering electromagnetic interference.
Glassivation integrity in electronic components
Glassivation testing ensures the dielectric layer integrity in semiconductor devices to prevent issues like electromigration.
The use of optical transceiver technology within space vehicles
Optical transceiver technology enhances satellite communication with high-speed, low-power, and radiation-tolerant performance.
Meteosat MSG to MTG transition
Meteosat satellites provide continuous geostationary weather data for Europe and Africa via advanced imaging systems.
Life Test for reliability assurance
Life test assesses long-term device reliability by accelerating wear-out failures using voltage and temperature stress.
Access to Electronic Design
Design for Manufacturing (DFM) and assembly.
The document underscores that adopting DFM techniques early in the project lifecycle ensures smoother production, lower costs, and quicker time-to-market for electronic products.
Characterization of Novel Composite Materials with Radiation Shielding Properties for Electronic Encapsulation (SRPROTEC Project)
Discover SRPROTEC project innovations: novel composite materials with advanced radiation shielding for safe and reliable electronic encapsulation
Entangled photon sources for quantum communications
Entangled Photon Sources enable secure quantum communication through SPDC, ideal for high-loss space applications.
Electromagnetic Compatibility (EMC) fundamentals
Electromagnetic Compatibility (EMC) ensures devices operate reliably without causing or suffering electromagnetic interference.
Glassivation integrity in electronic components
Glassivation testing ensures the dielectric layer integrity in semiconductor devices to prevent issues like electromigration.
The use of optical transceiver technology within space vehicles
Optical transceiver technology enhances satellite communication with high-speed, low-power, and radiation-tolerant performance.
Meteosat MSG to MTG transition
Meteosat satellites provide continuous geostationary weather data for Europe and Africa via advanced imaging systems.
Life Test for reliability assurance
Life test assesses long-term device reliability by accelerating wear-out failures using voltage and temperature stress.
Displacement Damage Testing and Mechanisms
Displacement Damage causes lattice defects in materials, affecting carrier lifetimes and device electrical performance.
Photonic Technologies in space applications: Selection and acceptance test criteria
Photonic technologies enables advanced space systems, requiring rigorous testing for reliability in harsh environments.
Thermoreflectance Thermal Imaging (TTI) for microelectronics
Thermoreflectance Thermal Imaging (TTI) maps micro-scale temperature gradients to detect hot spots in microelectronic devices.
Raman Thermography for semiconductor devices
Raman thermometry measures local temperature in microelectronics using Raman scattering with sub-micron spatial resolution.
IR Thermal Microscopy for microelectronic diagnostics
IR Thermal Microscopy maps temperature gradients in microelectronic devices to detect heat-induced failures.
Electromagnetic Compatibility (EMC) fundamentals
Electromagnetic Compatibility (EMC) ensures devices operate reliably without causing or suffering electromagnetic interference.
Glassivation integrity in electronic components
Glassivation testing ensures the dielectric layer integrity in semiconductor devices to prevent issues like electromigration.
ALTER EEE parts engineering and Product Assurance capabilities
EEE and Product Assurance scenario: The team of Senior EEE parts and PA engineers at ALTER will guide and help your team to understand the key drivers for the selection of the most suitable parts for your design, based on the deep knowledge of space market as well as the main standards used in Europe (ECSS-Q-ST-60s), US (NASA GSFC, DLA MIL-PRFs and QPL/QMLs) and commercial market (AEC-Q, …).
Advanced Materials for Space Radiation Shielding
Discover how the SRPROTEC project develops advanced composite materials to shield electronics from harmful space radiation
Physical Characterization of QFN Test Vehicles Manufactured with Radiation-Shielding Materials
Explore SRPROTEC project QFN test vehicles made with novel radiation-shielding composites for advanced electronic protection
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ALTER EEE parts engineering and Product Assurance capabilities
EEE and Product Assurance scenario: The team of Senior EEE parts and PA engineers at ALTER will guide and help your team to understand the key drivers for the selection of the most suitable parts for your design, based on the deep knowledge of space market as well as the main standards used in Europe (ECSS-Q-ST-60s), US (NASA GSFC, DLA MIL-PRFs and QPL/QMLs) and commercial market (AEC-Q, …).
Advanced Materials for Space Radiation Shielding
Discover how the SRPROTEC project develops advanced composite materials to shield electronics from harmful space radiation
Physical Characterization of QFN Test Vehicles Manufactured with Radiation-Shielding Materials
Explore SRPROTEC project QFN test vehicles made with novel radiation-shielding composites for advanced electronic protection
Characterization of Novel Composite Materials with Radiation Shielding Properties for Electronic Encapsulation (SRPROTEC Project)
Discover SRPROTEC project innovations: novel composite materials with advanced radiation shielding for safe and reliable electronic encapsulation
Entangled photon sources for quantum communications
Entangled Photon Sources enable secure quantum communication through SPDC, ideal for high-loss space applications.
Electromagnetic Compatibility (EMC) fundamentals
Electromagnetic Compatibility (EMC) ensures devices operate reliably without causing or suffering electromagnetic interference.
Glassivation integrity in electronic components
Glassivation testing ensures the dielectric layer integrity in semiconductor devices to prevent issues like electromigration.
The use of optical transceiver technology within space vehicles
Optical transceiver technology enhances satellite communication with high-speed, low-power, and radiation-tolerant performance.
Meteosat MSG to MTG transition
Meteosat satellites provide continuous geostationary weather data for Europe and Africa via advanced imaging systems.
Life Test for reliability assurance
Life test assesses long-term device reliability by accelerating wear-out failures using voltage and temperature stress.
Access to Datasheet
Click now to access valuable resources and elevate your semiconductor solutions with ALTER.
Electromagnetic Compatibility (EMC) fundamentals
Electromagnetic Compatibility (EMC) ensures devices operate reliably without causing or suffering electromagnetic interference.
Glassivation integrity in electronic components
Glassivation testing ensures the dielectric layer integrity in semiconductor devices to prevent issues like electromigration.
The use of optical transceiver technology within space vehicles
Optical transceiver technology enhances satellite communication with high-speed, low-power, and radiation-tolerant performance.
Meteosat MSG to MTG transition
Meteosat satellites provide continuous geostationary weather data for Europe and Africa via advanced imaging systems.
Life Test for reliability assurance
Life test assesses long-term device reliability by accelerating wear-out failures using voltage and temperature stress.
Displacement Damage Testing and Mechanisms
Displacement Damage causes lattice defects in materials, affecting carrier lifetimes and device electrical performance.
Photonic Technologies in space applications: Selection and acceptance test criteria
Photonic technologies enables advanced space systems, requiring rigorous testing for reliability in harsh environments.
Thermoreflectance Thermal Imaging (TTI) for microelectronics
Thermoreflectance Thermal Imaging (TTI) maps micro-scale temperature gradients to detect hot spots in microelectronic devices.
Raman Thermography for semiconductor devices
Raman thermometry measures local temperature in microelectronics using Raman scattering with sub-micron spatial resolution.
IR Thermal Microscopy for microelectronic diagnostics
IR Thermal Microscopy maps temperature gradients in microelectronic devices to detect heat-induced failures.
Electromagnetic Compatibility (EMC) fundamentals
Electromagnetic Compatibility (EMC) ensures devices operate reliably without causing or suffering electromagnetic interference.
Glassivation integrity in electronic components
Glassivation testing ensures the dielectric layer integrity in semiconductor devices to prevent issues like electromigration.
The use of optical transceiver technology within space vehicles
Optical transceiver technology enhances satellite communication with high-speed, low-power, and radiation-tolerant performance.
Meteosat MSG to MTG transition
Meteosat satellites provide continuous geostationary weather data for Europe and Africa via advanced imaging systems.
Life Test for reliability assurance
Life test assesses long-term device reliability by accelerating wear-out failures using voltage and temperature stress.
Displacement Damage Testing and Mechanisms
Displacement Damage causes lattice defects in materials, affecting carrier lifetimes and device electrical performance.
Photonic Technologies in space applications: Selection and acceptance test criteria
Photonic technologies enables advanced space systems, requiring rigorous testing for reliability in harsh environments.
Thermoreflectance Thermal Imaging (TTI) for microelectronics
Thermoreflectance Thermal Imaging (TTI) maps micro-scale temperature gradients to detect hot spots in microelectronic devices.
Raman Thermography for semiconductor devices
Raman thermometry measures local temperature in microelectronics using Raman scattering with sub-micron spatial resolution.
IR Thermal Microscopy for microelectronic diagnostics
IR Thermal Microscopy maps temperature gradients in microelectronic devices to detect heat-induced failures.