Blog
Featured
Inside the Component (Part II): Cross-Section Testing for Space Qualification & ECSS Compliance
In the second session of our “Inside the Component” series, we explore the cross-section tests required to certify electronic components for space missions. From PCB evaluations to wire-crimping and press-fit qualification, this session shows how cross-sectioning provides the physical evidence demanded by ECSS standards. You will learn how these results support destructive physical analysis (DPA), uncover manufacturing defects, and determine whether a device is truly fit for purpose in the extreme environment of space. Ideal for quality managers, project leaders, and professionals involved in space component qualification.
Latest news
Inside the Component (Part II): Cross-Section Testing for Space Qualification & ECSS Compliance
In the second session of our “Inside the Component” series, we explore the cross-section tests required to certify electronic components for space missions. From PCB evaluations to wire-crimping and press-fit qualification, this session shows how cross-sectioning provides the physical evidence demanded by ECSS standards. You will learn how these results support destructive physical analysis (DPA), uncover manufacturing defects, and determine whether a device is truly fit for purpose in the extreme environment of space. Ideal for quality managers, project leaders, and professionals involved in space component qualification.
Inside the Component (Part I): Mastering Cross-Section Sample Preparation for Space Electronics
Discover why rigorous cross-section sample preparation is essential for accurate failure analysis and reliability verification in space-grade electronics. This webinar walks you through every step, cutting, mounting, grinding, and polishing, and explains how each stage affects the quality and reproducibility of microsections.
ALTER EEE parts engineering and Product Assurance capabilities
EEE and Product Assurance scenario: The team of Senior EEE parts and PA engineers at ALTER will guide and help your team to understand the key drivers for the selection of the most suitable parts for your design, based on the deep knowledge of space market as well as the main standards used in Europe (ECSS-Q-ST-60s), US (NASA GSFC, DLA MIL-PRFs and QPL/QMLs) and commercial market (AEC-Q, …).
Advanced Materials for Space Radiation Shielding
Discover how the SRPROTEC project develops advanced composite materials to shield electronics from harmful space radiation
Physical Characterization of QFN Test Vehicles Manufactured with Radiation-Shielding Materials
Explore SRPROTEC project QFN test vehicles made with novel radiation-shielding composites for advanced electronic protection
Characterization of Novel Composite Materials with Radiation Shielding Properties for Electronic Encapsulation (SRPROTEC Project)
Discover SRPROTEC project innovations: novel composite materials with advanced radiation shielding for safe and reliable electronic encapsulation
Entangled photon sources for quantum communications
Entangled Photon Sources enable secure quantum communication through SPDC, ideal for high-loss space applications.
Electromagnetic Compatibility (EMC) fundamentals
Electromagnetic Compatibility (EMC) ensures devices operate reliably without causing or suffering electromagnetic interference.
Glassivation integrity in electronic components
Glassivation testing ensures the dielectric layer integrity in semiconductor devices to prevent issues like electromigration.
The use of optical transceiver technology within space vehicles
Optical transceiver technology enhances satellite communication with high-speed, low-power, and radiation-tolerant performance.
Inside the Component (Part II): Cross-Section Testing for Space Qualification & ECSS Compliance
In the second session of our “Inside the Component” series, we explore the cross-section tests required to certify electronic components for space missions. From PCB evaluations to wire-crimping and press-fit qualification, this session shows how cross-sectioning provides the physical evidence demanded by ECSS standards. You will learn how these results support destructive physical analysis (DPA), uncover manufacturing defects, and determine whether a device is truly fit for purpose in the extreme environment of space. Ideal for quality managers, project leaders, and professionals involved in space component qualification.
Inside the Component (Part I): Mastering Cross-Section Sample Preparation for Space Electronics
Discover why rigorous cross-section sample preparation is essential for accurate failure analysis and reliability verification in space-grade electronics. This webinar walks you through every step, cutting, mounting, grinding, and polishing, and explains how each stage affects the quality and reproducibility of microsections.
ALTER EEE parts engineering and Product Assurance capabilities
EEE and Product Assurance scenario: The team of Senior EEE parts and PA engineers at ALTER will guide and help your team to understand the key drivers for the selection of the most suitable parts for your design, based on the deep knowledge of space market as well as the main standards used in Europe (ECSS-Q-ST-60s), US (NASA GSFC, DLA MIL-PRFs and QPL/QMLs) and commercial market (AEC-Q, …).
Advanced Materials for Space Radiation Shielding
Discover how the SRPROTEC project develops advanced composite materials to shield electronics from harmful space radiation
Physical Characterization of QFN Test Vehicles Manufactured with Radiation-Shielding Materials
Explore SRPROTEC project QFN test vehicles made with novel radiation-shielding composites for advanced electronic protection
Characterization of Novel Composite Materials with Radiation Shielding Properties for Electronic Encapsulation (SRPROTEC Project)
Discover SRPROTEC project innovations: novel composite materials with advanced radiation shielding for safe and reliable electronic encapsulation
Entangled photon sources for quantum communications
Entangled Photon Sources enable secure quantum communication through SPDC, ideal for high-loss space applications.
Electromagnetic Compatibility (EMC) fundamentals
Electromagnetic Compatibility (EMC) ensures devices operate reliably without causing or suffering electromagnetic interference.
Glassivation integrity in electronic components
Glassivation testing ensures the dielectric layer integrity in semiconductor devices to prevent issues like electromigration.
The use of optical transceiver technology within space vehicles
Optical transceiver technology enhances satellite communication with high-speed, low-power, and radiation-tolerant performance.
Access to Electronic Design
Design for Manufacturing (DFM) and assembly.
The document underscores that adopting DFM techniques early in the project lifecycle ensures smoother production, lower costs, and quicker time-to-market for electronic products.
Advanced Materials for Space Radiation Shielding
Discover how the SRPROTEC project develops advanced composite materials to shield electronics from harmful space radiation
Physical Characterization of QFN Test Vehicles Manufactured with Radiation-Shielding Materials
Explore SRPROTEC project QFN test vehicles made with novel radiation-shielding composites for advanced electronic protection
Characterization of Novel Composite Materials with Radiation Shielding Properties for Electronic Encapsulation (SRPROTEC Project)
Discover SRPROTEC project innovations: novel composite materials with advanced radiation shielding for safe and reliable electronic encapsulation
Entangled photon sources for quantum communications
Entangled Photon Sources enable secure quantum communication through SPDC, ideal for high-loss space applications.
Electromagnetic Compatibility (EMC) fundamentals
Electromagnetic Compatibility (EMC) ensures devices operate reliably without causing or suffering electromagnetic interference.
Glassivation integrity in electronic components
Glassivation testing ensures the dielectric layer integrity in semiconductor devices to prevent issues like electromigration.
The use of optical transceiver technology within space vehicles
Optical transceiver technology enhances satellite communication with high-speed, low-power, and radiation-tolerant performance.
Meteosat MSG to MTG transition
Meteosat satellites provide continuous geostationary weather data for Europe and Africa via advanced imaging systems.
Life Test for reliability assurance
Life test assesses long-term device reliability by accelerating wear-out failures using voltage and temperature stress.
Displacement Damage Testing and Mechanisms
Displacement Damage causes lattice defects in materials, affecting carrier lifetimes and device electrical performance.
Photonic Technologies in space applications: Selection and acceptance test criteria
Photonic technologies enables advanced space systems, requiring rigorous testing for reliability in harsh environments.
Thermoreflectance Thermal Imaging (TTI) for microelectronics
Thermoreflectance Thermal Imaging (TTI) maps micro-scale temperature gradients to detect hot spots in microelectronic devices.
Characterization of Novel Composite Materials with Radiation Shielding Properties for Electronic Encapsulation (SRPROTEC Project)
Discover SRPROTEC project innovations: novel composite materials with advanced radiation shielding for safe and reliable electronic encapsulation
Entangled photon sources for quantum communications
Entangled Photon Sources enable secure quantum communication through SPDC, ideal for high-loss space applications.
Inside the Component (Part II): Cross-Section Testing for Space Qualification & ECSS Compliance
In the second session of our “Inside the Component” series, we explore the cross-section tests required to certify electronic components for space missions. From PCB evaluations to wire-crimping and press-fit qualification, this session shows how cross-sectioning provides the physical evidence demanded by ECSS standards. You will learn how these results support destructive physical analysis (DPA), uncover manufacturing defects, and determine whether a device is truly fit for purpose in the extreme environment of space. Ideal for quality managers, project leaders, and professionals involved in space component qualification.
Inside the Component (Part I): Mastering Cross-Section Sample Preparation for Space Electronics
Discover why rigorous cross-section sample preparation is essential for accurate failure analysis and reliability verification in space-grade electronics. This webinar walks you through every step, cutting, mounting, grinding, and polishing, and explains how each stage affects the quality and reproducibility of microsections.
ALTER EEE parts engineering and Product Assurance capabilities
EEE and Product Assurance scenario: The team of Senior EEE parts and PA engineers at ALTER will guide and help your team to understand the key drivers for the selection of the most suitable parts for your design, based on the deep knowledge of space market as well as the main standards used in Europe (ECSS-Q-ST-60s), US (NASA GSFC, DLA MIL-PRFs and QPL/QMLs) and commercial market (AEC-Q, …).
Posts Blog
Latest news
No Results Found
The page you requested could not be found. Try refining your search, or use the navigation above to locate the post.
Inside the Component (Part II): Cross-Section Testing for Space Qualification & ECSS Compliance
In the second session of our “Inside the Component” series, we explore the cross-section tests required to certify electronic components for space missions. From PCB evaluations to wire-crimping and press-fit qualification, this session shows how cross-sectioning provides the physical evidence demanded by ECSS standards. You will learn how these results support destructive physical analysis (DPA), uncover manufacturing defects, and determine whether a device is truly fit for purpose in the extreme environment of space. Ideal for quality managers, project leaders, and professionals involved in space component qualification.
Inside the Component (Part I): Mastering Cross-Section Sample Preparation for Space Electronics
Discover why rigorous cross-section sample preparation is essential for accurate failure analysis and reliability verification in space-grade electronics. This webinar walks you through every step, cutting, mounting, grinding, and polishing, and explains how each stage affects the quality and reproducibility of microsections.
ALTER EEE parts engineering and Product Assurance capabilities
EEE and Product Assurance scenario: The team of Senior EEE parts and PA engineers at ALTER will guide and help your team to understand the key drivers for the selection of the most suitable parts for your design, based on the deep knowledge of space market as well as the main standards used in Europe (ECSS-Q-ST-60s), US (NASA GSFC, DLA MIL-PRFs and QPL/QMLs) and commercial market (AEC-Q, …).
Advanced Materials for Space Radiation Shielding
Discover how the SRPROTEC project develops advanced composite materials to shield electronics from harmful space radiation
Physical Characterization of QFN Test Vehicles Manufactured with Radiation-Shielding Materials
Explore SRPROTEC project QFN test vehicles made with novel radiation-shielding composites for advanced electronic protection
Characterization of Novel Composite Materials with Radiation Shielding Properties for Electronic Encapsulation (SRPROTEC Project)
Discover SRPROTEC project innovations: novel composite materials with advanced radiation shielding for safe and reliable electronic encapsulation
Entangled photon sources for quantum communications
Entangled Photon Sources enable secure quantum communication through SPDC, ideal for high-loss space applications.
Electromagnetic Compatibility (EMC) fundamentals
Electromagnetic Compatibility (EMC) ensures devices operate reliably without causing or suffering electromagnetic interference.
Glassivation integrity in electronic components
Glassivation testing ensures the dielectric layer integrity in semiconductor devices to prevent issues like electromigration.
The use of optical transceiver technology within space vehicles
Optical transceiver technology enhances satellite communication with high-speed, low-power, and radiation-tolerant performance.
Access to Datasheet
Click now to access valuable resources and elevate your semiconductor solutions with ALTER.
Characterization of Novel Composite Materials with Radiation Shielding Properties for Electronic Encapsulation (SRPROTEC Project)
Discover SRPROTEC project innovations: novel composite materials with advanced radiation shielding for safe and reliable electronic encapsulation
Entangled photon sources for quantum communications
Entangled Photon Sources enable secure quantum communication through SPDC, ideal for high-loss space applications.
Electromagnetic Compatibility (EMC) fundamentals
Electromagnetic Compatibility (EMC) ensures devices operate reliably without causing or suffering electromagnetic interference.
Glassivation integrity in electronic components
Glassivation testing ensures the dielectric layer integrity in semiconductor devices to prevent issues like electromigration.
The use of optical transceiver technology within space vehicles
Optical transceiver technology enhances satellite communication with high-speed, low-power, and radiation-tolerant performance.
Meteosat MSG to MTG transition
Meteosat satellites provide continuous geostationary weather data for Europe and Africa via advanced imaging systems.
Life Test for reliability assurance
Life test assesses long-term device reliability by accelerating wear-out failures using voltage and temperature stress.
Displacement Damage Testing and Mechanisms
Displacement Damage causes lattice defects in materials, affecting carrier lifetimes and device electrical performance.
Photonic Technologies in space applications: Selection and acceptance test criteria
Photonic technologies enables advanced space systems, requiring rigorous testing for reliability in harsh environments.
Thermoreflectance Thermal Imaging (TTI) for microelectronics
Thermoreflectance Thermal Imaging (TTI) maps micro-scale temperature gradients to detect hot spots in microelectronic devices.
Characterization of Novel Composite Materials with Radiation Shielding Properties for Electronic Encapsulation (SRPROTEC Project)
Discover SRPROTEC project innovations: novel composite materials with advanced radiation shielding for safe and reliable electronic encapsulation
Entangled photon sources for quantum communications
Entangled Photon Sources enable secure quantum communication through SPDC, ideal for high-loss space applications.
Electromagnetic Compatibility (EMC) fundamentals
Electromagnetic Compatibility (EMC) ensures devices operate reliably without causing or suffering electromagnetic interference.
Glassivation integrity in electronic components
Glassivation testing ensures the dielectric layer integrity in semiconductor devices to prevent issues like electromigration.
The use of optical transceiver technology within space vehicles
Optical transceiver technology enhances satellite communication with high-speed, low-power, and radiation-tolerant performance.
Meteosat MSG to MTG transition
Meteosat satellites provide continuous geostationary weather data for Europe and Africa via advanced imaging systems.
Life Test for reliability assurance
Life test assesses long-term device reliability by accelerating wear-out failures using voltage and temperature stress.
Displacement Damage Testing and Mechanisms
Displacement Damage causes lattice defects in materials, affecting carrier lifetimes and device electrical performance.
Photonic Technologies in space applications: Selection and acceptance test criteria
Photonic technologies enables advanced space systems, requiring rigorous testing for reliability in harsh environments.
Thermoreflectance Thermal Imaging (TTI) for microelectronics
Thermoreflectance Thermal Imaging (TTI) maps micro-scale temperature gradients to detect hot spots in microelectronic devices.