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Inside the Component (Part II): Cross-Section Testing for Space Qualification & ECSS Compliance

Inside the Component (Part II): Cross-Section Testing for Space Qualification & ECSS Compliance

In the second session of our “Inside the Component” series, we explore the cross-section tests required to certify electronic components for space missions. From PCB evaluations to wire-crimping and press-fit qualification, this session shows how cross-sectioning provides the physical evidence demanded by ECSS standards. You will learn how these results support destructive physical analysis (DPA), uncover manufacturing defects, and determine whether a device is truly fit for purpose in the extreme environment of space. Ideal for quality managers, project leaders, and professionals involved in space component qualification.

read more
Inside the Component (Part II): Cross-Section Testing for Space Qualification & ECSS Compliance

Inside the Component (Part II): Cross-Section Testing for Space Qualification & ECSS Compliance

In the second session of our “Inside the Component” series, we explore the cross-section tests required to certify electronic components for space missions. From PCB evaluations to wire-crimping and press-fit qualification, this session shows how cross-sectioning provides the physical evidence demanded by ECSS standards. You will learn how these results support destructive physical analysis (DPA), uncover manufacturing defects, and determine whether a device is truly fit for purpose in the extreme environment of space. Ideal for quality managers, project leaders, and professionals involved in space component qualification.

read more

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Design for Manufacturing (DFM) and assembly.

The document underscores that adopting DFM techniques early in the project lifecycle ensures smoother production, lower costs, and quicker time-to-market for electronic products.

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Inside the Component (Part II): Cross-Section Testing for Space Qualification & ECSS Compliance

Inside the Component (Part II): Cross-Section Testing for Space Qualification & ECSS Compliance

In the second session of our “Inside the Component” series, we explore the cross-section tests required to certify electronic components for space missions. From PCB evaluations to wire-crimping and press-fit qualification, this session shows how cross-sectioning provides the physical evidence demanded by ECSS standards. You will learn how these results support destructive physical analysis (DPA), uncover manufacturing defects, and determine whether a device is truly fit for purpose in the extreme environment of space. Ideal for quality managers, project leaders, and professionals involved in space component qualification.

read more

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Inside the Component (Part II): Cross-Section Testing for Space Qualification & ECSS Compliance

Inside the Component (Part II): Cross-Section Testing for Space Qualification & ECSS Compliance

In the second session of our “Inside the Component” series, we explore the cross-section tests required to certify electronic components for space missions. From PCB evaluations to wire-crimping and press-fit qualification, this session shows how cross-sectioning provides the physical evidence demanded by ECSS standards. You will learn how these results support destructive physical analysis (DPA), uncover manufacturing defects, and determine whether a device is truly fit for purpose in the extreme environment of space. Ideal for quality managers, project leaders, and professionals involved in space component qualification.

read more

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Unlock the potential of our Packaging and Assembly expertise.

Click now to access valuable resources and elevate your semiconductor solutions with ALTER.

Design for Manufacturing Guide Cover
Download 25 KB | PDF
Inside the Component (Part II): Cross-Section Testing for Space Qualification & ECSS Compliance

Inside the Component (Part II): Cross-Section Testing for Space Qualification & ECSS Compliance

In the second session of our “Inside the Component” series, we explore the cross-section tests required to certify electronic components for space missions. From PCB evaluations to wire-crimping and press-fit qualification, this session shows how cross-sectioning provides the physical evidence demanded by ECSS standards. You will learn how these results support destructive physical analysis (DPA), uncover manufacturing defects, and determine whether a device is truly fit for purpose in the extreme environment of space. Ideal for quality managers, project leaders, and professionals involved in space component qualification.

read more
Inside the Component (Part II): Cross-Section Testing for Space Qualification & ECSS Compliance

Inside the Component (Part II): Cross-Section Testing for Space Qualification & ECSS Compliance

In the second session of our “Inside the Component” series, we explore the cross-section tests required to certify electronic components for space missions. From PCB evaluations to wire-crimping and press-fit qualification, this session shows how cross-sectioning provides the physical evidence demanded by ECSS standards. You will learn how these results support destructive physical analysis (DPA), uncover manufacturing defects, and determine whether a device is truly fit for purpose in the extreme environment of space. Ideal for quality managers, project leaders, and professionals involved in space component qualification.

read more