Electronic components for space cannot fail — and understanding what happens inside them starts with proper sample preparation.

In this first session of our “Inside the Component” series, we will walk through the complete methodology of cross-section sample preparation: cutting, mounting, grinding, and polishing.

You will see how each preparation step directly affects the accuracy of the analysis, and how improper techniques can mask or distort hidden defects.

We will explain why rigorous preparation is essential for failure analysis, process validation, and reliability assurance in space-grade electronics. From basic printed circuit boards (PCBs) to complex integrated circuits (ICs). 

A must-attend for engineers, laboratory technicians, and manufacturers who need high-quality, reproducible microsections.

Cross-section preparation is crucial for electronic components because it allows for detailed internal analysis in quality control, failure analysis, and R&D. By cutting, mounting, and polishing a component, manufacturers can inspect the internal structure for defects like voids, cracks, and poor layer adhesion, which are essential for verifying a component’s structural integrity and performance. This process is vital for ensuring reliability in everything from basic printed circuit boards (PCBs) to complex integrated circuits (ICs) and is used to improve manufacturing processes and identify the root causes of failures. 

Stay tuned for the second webinar; we’ll be announcing the date soon. Don’t miss the second episode: Inside the Component (Part II): Cross-Section Testing for Space Qualification & ECSS Compliance