In the second session of our “Inside the Component” series, we dive into the cross-section tests required to certify electronic components for space missions.
From PCB analysis to wire-crimping and press-fit qualification, we will show how cross-sectioning delivers the physical evidence demanded by ECSS standards (ECSS-Q-ST-60, 70, 60-13).
You will learn how cross-section results support destructive physical analysis (DPA), reveal manufacturing defects, and help determine whether a device is truly “fit for purpose” in the extreme conditions of space.
Ideal for quality managers, project leaders, and anyone involved in space component qualification.
2. Cross-section analysis II. Cross-section tests: PCB/wire crimping/press-fit qualification
Cross-section analysis is an essential and mandatory part of the qualification process for electronic components used in space applications. Space agencies such as ESA have specific standards (e.g., ESA ECSS-Q-ST-60/70/60-13 series) that require destructive physical analysis (DPA), which relies heavily on cross-sectioning, to ensure maximum reliability and dependability in the extreme conditions of space.
Cross-section analysis provides the critical physical evidence needed to certify that a component is “fit for purpose” and capable of surviving the harsh space.
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Mari Carmen López
Mari Carmne oversees the Materials & Process Laboratory at ALTER, focusing on studying the environmental impact on electrical components, materials, and processes. As the laboratory head, she manages assessments to determine the quality of bare and assembled printed circuit boards, ensuring compliance with ECSS standards or customer specifications.