# Semiconductor Labs \& Engineering: Expert Laboratory and Engineering Services for High\-Reliability EEE components in space

> ALTER provides advanced semiconductor testing and engineering services, ensuring reliability for EEE components in space applications\.

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## Pages
- [Long\-term storage](https://semiconductor.altertechnology.com/long-term-storage-for-electronic-components/): Bond pull test measures bond strength to ensure reliability under stress, verifying compliance with manufacturing requirements\.
- [Additional services for parts engineering and logistics](https://semiconductor.altertechnology.com/engineering-services/parts-engineering-and-product-assurance-service/parts-engineering-and-logistics-additional-services/): Parts engineering and logistics support for space missions, including testing, radiation and procurement services\.
- [Book a meeting](https://semiconductor.altertechnology.com/long-term-storage-for-electronic-components/book-a-meeting/): Discover how TAB®PLUS can help you eliminate aging risks and secure your components for decades\.
➡️ Request a meeting with our experts
- [Whitepaper: TAB®PLUS vs\. Nitrogen Storage](https://semiconductor.altertechnology.com/resources/downloads/whitepaper-tabplus-vs-nitrogen-storage/): This whitepaper compares traditional nitrogen storage with the advanced TAB®PLUS method—and shows why TAB®PLUS delivers superior long\-term protection\.
- [Contact](https://semiconductor.altertechnology.com/contact/): Contact ALTER in Seville, Spain, for expertise in EEE components and laboratory services at \+34 95 446 70 50\.

## Posts
- [C\-SAM non\-destructive inspection of microelectronic parts](https://semiconductor.altertechnology.com/material-processing/c-sam-non-destructive-inspection-of-microelectronic-parts/): C\-SAM is a non\-destructive technique used to detect internal defects like delamination in microelectronic components via acoustic imaging\.
- [Thermomechanical failures in Plated Through Vias \(PTVs\)](https://semiconductor.altertechnology.com/material-processing/thermomechanical-failures-in-plated-through-vias-ptvs/): Thermomechanical failures in PTVs result from CTE mismatches, causing fatigue cracks and inner\-layer separation during thermal cycling\.
- [EEE parts engineering and Product Assurance for space missions](https://semiconductor.altertechnology.com/engineering-services/eee-parts-engineering-and-product-assurance-capabilities/): EEE parts engineering and product assurance for space missions, including DCL support, radiation analysis, testing, and ESA/NASA compliance\.
- [Electromagnetic Compatibility EMC requirements and testing](https://semiconductor.altertechnology.com/electrical-testing/electromagnetic-compatibility-emc/): Electromagnetic Compatibility \(EMC\) ensures devices operate reliably without causing or suffering electromagnetic interference\.
- [Evolution of COTS EEE parts in space applications](https://semiconductor.altertechnology.com/cots/cots-eee-parts-in-space-applications/): COTS parts offer a viable, cost\-effective alternative for space applications, requiring optimized risk management strategies\.

## Type
- [section](https://semiconductor.altertechnology.com/layout_type/section/)
- [module](https://semiconductor.altertechnology.com/layout_type/module/)
- [row](https://semiconductor.altertechnology.com/layout_type/row/)
- [layout](https://semiconductor.altertechnology.com/layout_type/layout/)

## Module Width
- [regular](https://semiconductor.altertechnology.com/module_width/regular/)
- [fullwidth](https://semiconductor.altertechnology.com/module_width/fullwidth/)

## Scope
- [not\_global](https://semiconductor.altertechnology.com/scope/not_global/)
- [global](https://semiconductor.altertechnology.com/scope/global/)

## Optional
- [Sitemap index](https://semiconductor.altertechnology.com/sitemap_index.xml)