C-SAM
What is C-SAM? Scanning acoustic microscopy (SAM), also denominated acoustic micro imaging (AMI), and scanning acoustic tomography (SAT) is a consolidated and recognized tool for quality control, inspection, and failure analysis of microelectronic components and materials.
Among other types of failures, acoustic techniques are particularly suitable for detecting those irregularities involving materials and density changes, including delaminations, voids, porosity and cracks, in any EEE components.
Therefore this NON-DESTRUCTIVE testing method is included in different EVALUATION, SCREENING, and LOT VALIDATION flows for several families of EEE components.
C-SAM Testing Capabilities
We offer Scanning Acoustic Microscopy (C-SAM) testing capabilities and services, that include:
Reliability test
This test consists of two phases: Evaluation and Qualification. During the evaluation phase, components/technologies can be extensively characterized, and margins determined. If the evaluation is successful, we can then proceed with Qualification; once qualified, the component is listed in the QPL (Qualified Parts List).
Quality Control / Screening task
In ALTER, we specialize in designing tests and screening procedures for electronic components used in the aerospace, defense, and industrial electronics industries. Tests, inspections, or a combination thereof, imposed on 100% of parts to remove unsatisfactory items or those likely to exhibit early failures.
Preliminary non-destructive inspection in DPAs
Destructive Physical Analysis DPA is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements.
Failure Analysis
Failure analysis is the process of analyzing the component data or the component itself to determine the reason(s) for degraded performance or catastrophic failure of a component either, during component manufacturing and testing, during incoming inspection, or after delivery to the customer, at the final application.
Radiographic X-Ray Inspection
The purpose of a Radiographic X-Ray Inspection is to nondestructively detect defects that are not otherwise visible: improper positioning of parts, broken elements, inhomogeneities in materials, foreign objects…
Microsection
Microsection analysis is performed on an assembled through-hole device as a part of failure analysis. Cross-section through the plane of interest can provide helpful information about solder defects, PCB inner layers, and internal construction. The plane of interest must be selected considering PCB characteristics, observed failure, and previous test results.
C-SAM Characteristics
Scanning Acoustic Microscopy (C-SAM) has revealed as the most effective and complete non-destructive approach for the detection of critical and latent anomalies within COTS and plastic encapsulated microelectronics
C-SAM Meaning
The working principle of C-SAM is based on the reflection that acoustic waves experience at the interface between different media and density irregularities.
C-SAM Applications
C-SAM is a reliable and powerful tool for the non-destructive testing of microelectronic parts and base materials. Moreover, it is mandatory for different applications such as those described below for various sectors.
C-SAM Short Technical Notes
We offer short articles giving a brief description of a specific development, technique, or procedure of C-SAM’s capabilities and equipment.