Moisture Sensitivity Level (MSL) Testing
Comprehensive MSL testing and qualification under IPC/JEDEC standards to ensure moisture-sensitive components for space and aerospace applications are fully protected.
At ALTER TECHNOLOGY, we offer full-spectrum MSL qualification using accredited procedures (J-STD‑020, J-STD‑033, JESD22‑A113) to classify and control the floor life of moisture-sensitive devices (MSDs). Our services guarantee compliance with ECSS, IPC, JEDEC, and MIL standards—ensuring components avoid delamination, “popcorn” cracking, or internal failure during reflow processes
Key Lab Areas in MSL Qualification
Standards & Preconditioning
Following IPC/JEDEC J‑STD‑020D for moisture sensitivity classification and JESD22‑A113 for preconditioning sequences—bake, soak, and multiple reflow cycles to accurately determine MSL level.
Visual & Acoustic Inspection
We perform initial and post‑reflow inspections using high-resolution X-ray and C‑SAM (Acoustic Microscopy) to detect internal delamination, cracks, wire-bond failures, or “popcorn effect” before visible damage appears
Bake & Floor-Life Control
ALTER’s thermal vacuum ovens support controlled baking and humidity conditioning. We program precise baking times per package thickness and MSL class (Levels 1–6) to restore or extend floor life
Moisture Soak & Reflow
Devices are exposed to controlled humidity and temperature environments to simulate storage conditions per J-STD-020D.1. After moisture soak, samples undergo up to three reflow cycles using ovens that meet SnPb and Pb-free solder profiles. This step is critical to evaluate the component’s resistance to moisture-induced failures during actual PCB assembly processes.
Moisture Barrier Packaging
We seal devices in Moisture Barrier Bags (MBBs) with desiccants and humidity indicator cards per IPC/JEDEC J‑STD‑033. Classifications include: MSL 1 (unlimited floor life), MSL 2–6—each with defined exposure limits and handling instructions
Why choose ALTER?
Complete Standards Coverage
ECSS, IPC/JEDEC J‑STD‑020/033, JESD22‑A113, MIL‑STD
State-of-the art Equipment
Thermal vacuum chambers, X‑ray, acoustic, electronic and optical microscopy (SEM, C-SAM)
Fast Turnaround
Efficient throughput tailored to aerospace project timelines
Expertise in Space & Hi-Rel Components
Handling COTS, PEM/PED, hybrid microcircuits, BGAs, QFN, hermetic…
Counterfeit Detection Integration
Optionally combined with DPA, RGA, TMA, outgassing analysis
MSL Levels At A Glance
(Data per J‑STD‑020/033)
| MSL Level | Floor Life @30 °C/60 % RH | Requires Baking? |
| MSL 1 | Unlimited (≤85 % RH) | No |
| MSL 2 | 1 year | No |
| MSL 2a | 4 weeks | No |
| MSL 3 | 168 h | Yes, if exceeded |
| MSL 4 | 72 h | Yes |
| MSL 5 | 48 h | Yes |
| MSL 5a | 24 h | Yes |
| MSL 6 | Requires bake before use | Yes |
Core Differentiators
- Custom Bake Profiles: Based on package thickness, humidity exposure & MSL class
- Integrated Analytical Testing: Combine with RGA, outgassing (ASTM E595), DPA—ideal for ESA-level reliability assessments
- Holistic Qualification: Prepare devices for space, aerospace, defense or harsh-environment board
- Tailored Reporting: Supports procurement/quality teams with full traceability and compliance documentation