Destructive Physical Analysis (DPA)
Destructive Physical Analysis (DPA) is a systematic and meticulous evaluation process for Electrical, Electronic, and Electromechanical (EEE) components. By conducting a detailed and controlled physical inspection, DPA ensures that manufactured lots comply with technical specifications and project requirements.
We leverage decades of expertise and advanced capabilities to perform Destructive Physical Analysis (DPA), ensuring that Electrical, Electronic, and Electromechanical (EEE) components meet the highest quality and reliability standards. Through our meticulous and systematic evaluation process, we help our clients verify that manufactured lots comply with technical specifications and project requirements.
Why perform a Destructive Physical Analysis (DPA Test)?
DPA helps identify design, manufacturing, or processing issues that may go unnoticed during standard inspections and tests performed by component manufacturers. Detecting these anomalies early prevents potential degradation or failure of the systems that rely on these devices.
By conducting a DPA, defects and risks can be mitigated before they affect your system’s performance or reliability.
The DPA process: Key stages and tests
The analysis is conducted on samples randomly selected from the lot, employing a combination of tests and inspections tailored to the component type and package. Key techniques include:
- X-ray Examination: Non-destructive internal evaluation to detect hidden defects.
- External Visual Inspection: Verification of physical defects or assembly issues.
- Seal Tests (Fine and Gross Leaks): Ensures the integrity of the component package.
- Particle Impact Noise Detection (P.I.N.D): Detects loose particles inside the package.
- Solderability: Assesses the adherence quality of solder materials.
- Internal Visual Inspection: Detailed evaluation of internal surfaces.
- Bond Pull Tests: Determines the strength of internal connections.
- Scanning Electron Microscope (SEM): High-resolution analysis for detecting micro-defects.
- Die Shear Test: Tests the mechanical robustness of the die.
Hybrid device after the opening process
RF filter failure detected during the internal visual inspection which is a part of the cross sectioning process.
Standards and compliance
The DPA process is conducted in compliance with internationally recognized standards, including:
These standards ensure that the analysis meets the stringent quality and reliability requirements of industries like aerospace and defense.
SEM inspection of metallization after removing the glassivation
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