Destructive Physical Analysis (DPA)
Destructive Physical Analysis (DPA) is a systematic and meticulous evaluation process for Electrical, Electronic, and Electromechanical (EEE) components. By conducting a detailed and controlled physical inspection, DPA ensures that manufactured lots comply with technical specifications and project requirements.
We leverage decades of expertise and advanced capabilities to perform Destructive Physical Analysis (DPA), ensuring that Electrical, Electronic, and Electromechanical (EEE) components meet the highest quality and reliability standards. Through our meticulous and systematic evaluation process, we help our clients verify that manufactured lots comply with technical specifications and project requirements.
As part of ALTER Technology’s Product Enhancement division, Destructive Physical Analysis supports OEMs, equipment manufacturers and system integrators that need to assess the internal quality, construction and workmanship of existing EEE components before qualification, acceptance or use. DPA can form part of a wider Component Qualification strategy when additional physical evidence is required to support a component decision.
Why perform a Destructive Physical Analysis (DPA Test)?
DPA helps identify design, manufacturing, or processing issues that may go unnoticed during standard inspections and tests performed by component manufacturers. Detecting these anomalies early prevents potential degradation or failure of the systems that rely on these devices.
By conducting a DPA, defects and risks can be mitigated before they affect your system’s performance or reliability.
Physical analysis may also support investigations where component authenticity or internal construction needs to be verified. When the primary concern is whether a component may be counterfeit or misrepresented, ALTER’s Counterfeit Detection service provides a dedicated authentication route combining documentary, visual, physical and electrical assessment.
The DPA process: Key stages and tests
The analysis is conducted on samples randomly selected from the lot, employing a combination of tests and inspections tailored to the component type and package. Key techniques include:
- X-ray Examination: Non-destructive internal evaluation to detect hidden defects.
- External Visual Inspection: Verification of physical defects or assembly issues.
- Seal Tests (Fine and Gross Leaks): Ensures the integrity of the component package.
- Particle Impact Noise Detection (P.I.N.D): Detects loose particles inside the package.
- Solderability: Assesses the adherence quality of solder materials.
- Internal Visual Inspection: Detailed evaluation of internal surfaces.
- Bond Pull Tests: Determines the strength of internal connections.
- Scanning Electron Microscope (SEM): High-resolution analysis for detecting micro-defects.
- Die Shear Test: Tests the mechanical robustness of the die.
Hybrid device after the opening process
RF filter failure detected during the internal visual inspection which is a part of the cross sectioning process.
The combination of inspections used in a DPA depends on the component, applicable requirements and the characteristics being assessed. For additional technical guidance on the purpose, sequence and requirements of this type of analysis, see doEEEt’s resources on DPA parts examination and DPA requirements for space projects.
Standards and compliance
The DPA process is conducted in compliance with internationally recognized standards, including:
These standards ensure that the analysis meets the stringent quality and reliability requirements of industries like aerospace and defense.
SEM inspection of metallization after removing the glassivation
When detailed examination of specific internal structures or materials is required, DPA can also be complemented by specialist techniques such as SEM inspection and Cross-Section Testing. These techniques provide additional evidence on internal construction, materials and manufacturing anomalies when required by the investigation.
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