Constructional Analysis
Similar to Destructive Physical Analysis (DPA) and Failure Analysis, Constructional Analysis is not a single test but a series of evaluations aimed at thoroughly examining EEE components. These tests verify the quality of a produced lot, ensuring that each component meets the required standards for high-reliability applications.
Our Constructional Analysis services are designed to support clients who require the highest levels of quality and reliability for their products and procedures. This comprehensive service provides an in-depth understanding of the manufacturing technologies, detailed construction insights, and the identification of potential weaknesses or areas for improvement, such as missing parts or material inconsistencies.
Constructional analysis across the semiconductor product lifecycle
For COTS parts, production lots or components of uncertain origin or quality, constructional analysis helps verify manufacturing consistency, identify deviations and assess potential weaknesses. This application forms part of ALTER’s Product Enhancement activities and can support counterfeit detection, COTS qualification and failure analysis.
Key Constructional Analysis tests
- Detects and identifies materials used in semiconductor and microelectronic manufacturing.
- Ensures the absence of prohibited substances, such as pure tin finishes that may cause undesirable whisker growth.
- Validates lead finishes to determine the correct soldering profile for each component type.
Dimensions and Weight Check
- Compares the actual dimensions and weight of components with specifications.
- Detects manufacturer deviations and handling damages that may impact device assembly and final application.
Scanning Acoustic Microscopy (SAM)
- Non-destructive testing tool for identifying internal defects in encapsulated systems.
- Detects accidental constructional failures (e.g., missing parts) and material inconsistencies that could compromise performance.
Scanning Electron Microscopy (SEM)
- Analyzes design, construction, or handling defects.
- Verifies interconnect metallization in integrated circuits and performs in-depth technology studies, such as reverse engineering or die cross-sectioning.
Focused Ion Beam (FIB) Inspection
- Provides high-resolution 2D and 3D characterization and nano-prototyping.
- Essential for wafer acceptance, design validation, failure analysis, and long-term reliability evaluations.
X-Ray Tomography
- Detects internal physical defects such as foreign objects, improper interconnects, voids in materials, and die attach or encapsulating issues.
- Identifies inhomogeneities and improper positioning of elements within electronic components.
- Evaluates the effects of vibration on component parts across specified frequency ranges.
- Tests are conducted under various conditions in compliance with applicable standards to ensure durability.
Residual Gas Analysis (RGA)
- Destructive test examining the atmosphere inside hermetically sealed devices.
- Measures moisture and other gases to assess sealing quality and identify potential long-term reliability issues, such as corrosion or leakage.
External Visual Inspection (EVI)
- Assesses the quality of parts during customer source inspections (Buy-off).
- Key for initial quality evaluations and pre-shipment verifications.
Internal Visual Inspection
- Destructive test to verify internal materials, design, construction, and assembly against acquisition documents.
- Often performed on unsealed devices before capping to ensure no defects have appeared during prior testing.
Combining non-destructive and destructive analysis
When access to the die, interconnections or internal package structure is required, controlled decapsulation can expose these features for further inspection and analysis. Additional technical information is available in the doEEEt guide to decapsulation of packaged electronic devices.
