In the second session of our “Inside the Component” series, we explore the cross-section tests required to certify electronic components for space missions. From PCB evaluations to wire-crimping and press-fit qualification, this session shows how cross-sectioning provides the physical evidence demanded by ECSS standards. You will learn how these results support destructive physical analysis (DPA), uncover manufacturing defects, and determine whether a device is truly fit for purpose in the extreme environment of space. Ideal for quality managers, project leaders, and professionals involved in space component qualification.

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